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Liquid Cooling

Frost & Sullivan Names PDG APAC Customer Value Leader for 2026

San Antonio – October 14, 2026 -- Princeton Digital Group (PDG) has won Frost & Sullivan's 2026 Asia-Pacific Customer Value Leadership Recognition in data centre infrastructure and operations, backed by a portfolio approaching two gigawatts of capacity at the time of assessment.

Frost & Sullivan scored PDG on strategy effectiveness and execution across varied APAC markets

The analyst firm benchmarks candidates on two dimensions: strategy effectiveness and strategy execution. It said PDG performed strongly on both, aligning growth with hyperscale customer demand while executing consistently in markets that differ in infrastructure maturity, regulation, power availability and construction ecosystems.

Compal Shows Blackwell Ultra, Rubin Servers at OCP Summit 2026

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Compal Shows Blackwell Ultra, Rubin Servers at OCP Summit 2026

San Jose – October 13, 2026 -- Compal Electronics (TWSE: 2324) will show an eight-GPU, liquid-cooled NVIDIA Blackwell Ultra server alongside Rubin-based and Vera CPU systems at OCP Global Summit 2026. The company is pitching shorter time-to-AI to cloud service providers, enterprises and AI infrastructure operators.

Compal's 4U OG430-2-L1 server packs eight Blackwell Ultra GPUs

The OG430-2-L1 is a 4U direct liquid-cooled server built on the NVIDIA HGX B300 platform with eight NVIDIA Blackwell Ultra GPUs. It targets AI training, reasoning, inference and HPC workloads. Compal bundles platform engineering, liquid cooling, system validation, rack integration and manufacturing readiness to cut the engineering effort between buying new accelerators and running them in production.

CyberTAN, Marvell Unveil Liquid-Cooled 102.4 Tbps Switch Blueprint

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CyberTAN, Marvell Unveil Liquid-Cooled 102.4 Tbps Switch Blueprint

San Jose – October 13, 2026 -- CyberTAN Technology has unveiled a liquid-cooled Ethernet switch platform architecture built around Marvell's 102.4 Tbps Teralynx T100 silicon, and says a live demonstration at OCP Global Summit 2026 reached a Power Usage Effectiveness (PUE) of 1.1.

Pallas Series targets 1,000-watt heat loads with direct-to-chip cooling

The Pallas Series 1.6T platform is designed to accommodate the 3nm Marvell T100 and its 25% energy-saving advantage. CyberTAN pairs the silicon with its proprietary Direct-to-Chip (D2C) liquid-cooling engineering. The company says the design can manage more than 1,000 watts of localized heat dissipation while keeping port density high.

CyberTAN frames the work as a response to thermal and power limits in AI clusters, where generative AI and hyperscale workloads are driving demand for more efficient silicon and rack-level cooling.

MSI Unveils 21-Inch ORv3 Servers With 600W Nodes at OCP Summit

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MSI Unveils 21-Inch ORv3 Servers With 600W Nodes at OCP Summit

San Jose – October 13, 2026 -- MSI is expanding its 21-inch ORv3 portfolio with DC-MHS-based 2-node platforms on AMD EPYC 9006 Series processors, supporting up to 600W TDP per node, at the 2026 OCP Global Summit (Booth #A49). The systems come in 2OU air-cooled and 1OU direct liquid-cooled versions and lead a booth lineup that also includes NVIDIA MGX rack and GPU server platforms and the XpertStation WS300 desktop AI supercomputer.

MSI offers two ORv3 nodes with 48V busbar power and PCIe 6.0

Both ORv3 platforms combine 48V busbar power, PCIe 6.0 connectivity and DC-SCM-based management. Memory speeds reach 8,000 MT/s with RDIMM and 12,800 MT/s with MRDIMM. Each node carries 2 PCIe 6.0 x16 expansion slots and front-access NVMe storage.

Vertiv Acquires Strategic Thermal Labs to Deepen Liquid Cooling

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Vertiv Acquires Strategic Thermal Labs to Deepen Liquid Cooling

Columbus – – October 12, 2026 -- Vertiv (NYSE: VRT) has acquired Strategic Thermal Labs LLC (STL), a specialist in advanced liquid-cooling technologies, to strengthen its engineering capability where server-side liquid cooling meets supporting infrastructure in AI and high-performance computing environments. Financial terms were not disclosed.

STL adds cold-plate design and high-density thermal validation expertise

STL brings cold-plate design, server-side liquid cooling and high-density thermal validation capabilities. Vertiv expects the expertise to improve its ability to simulate and emulate real high-density compute conditions.

The company also expects to optimize the interaction between the thermal chain and the power train. It plans to support customers across design, integration, commissioning and lifecycle operations.

Vertiv 2.3 MW CDU Becomes First NVIDIA DSX Ready Qualified Unit

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Vertiv 2.3 MW CDU Becomes First NVIDIA DSX Ready Qualified Unit

Columbus, Ohio – October 12, 2026 -- Vertiv's 2.3 MW CoolChip coolant distribution unit (CDU) has qualified as a NVIDIA DSX Ready CDU, making it the first CDU to qualify specifically under the program, the company said.

Vertiv (NYSE: VRT) is among the initial providers of qualified CDU solutions in NVIDIA DSX Ready. The program lets AI factory builders identify power and cooling products that meet applicable NVIDIA DSX requirements.

Qualification rests on NVIDIA's CDU self-qualification suite

For CDU providers, the program uses the NVIDIA CDU self-qualification suite to determine whether a specific offering meets applicable functional requirements. NVIDIA DSX Ready connects individual products to those requirements.

The qualification does not replace site-specific engineering. Customers must still determine how a qualified product fits their facility design, system configuration and operating requirements.

Vertiv to Buy Ireland's KES to Extend Liquid-Cooling Services to EMEA

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Vertiv to Buy Ireland's KES to Extend Liquid-Cooling Services to EMEA

Columbus, Ohio – October 12, 2026 -- Vertiv Holdings Co (NYSE: VRT) has agreed to acquire King Environmental Services Ltd. (KES), a Europe-based provider of fluid management, commissioning and load-testing services for high-density, liquid-cooled data centers, with closing expected in the fourth quarter of 2026.

Vertiv did not disclose financial terms. The company said the deal is not expected to be material to its financial results.

KES brings fluid management and load testing to Vertiv's EMEA services

The acquisition extends Vertiv's thermal management services into Europe, the Middle East and Africa (EMEA). KES is headquartered near Dublin, Ireland, and serves customers across the region.

Wistron, Wiwynn Ready NVIDIA Vera Rubin NVL72 Racks for OCP Summit

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Wistron, Wiwynn Ready NVIDIA Vera Rubin NVL72 Racks for OCP Summit

San Jose – October 12, 2026 -- Wistron Corporation and Wiwynn Corporation say they are among the first manufacturers ready to build NVIDIA's Vera Rubin NVL72 rack-scale platform, which unifies 72 Rubin GPUs and 36 Vera CPUs in a fully liquid-cooled design. The two companies are showing the system at the 2026 OCP Global Summit in San Jose under the theme "Create AI Beyond Limits."

Vera Rubin NVL72 combines 72 GPUs, 36 CPUs and BlueField-4 DPUs

The NVL72 platform links 72 NVIDIA Rubin GPUs and 36 NVIDIA Vera CPUs through NVIDIA NVLink. It also integrates NVIDIA ConnectX-9 SuperNICs and NVIDIA BlueField-4 DPUs. Wistron and Wiwynn describe it as built for the resiliency, energy efficiency and scalability that AI factories demand, and optimized for frontier AI model training, inference and reasoning.

High-Density Rack Market to Hit $52.5B by 2034 on AI Cooling Demand

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High-Density Rack Market to Hit $52.5B by 2034 on AI Cooling Demand

Pune – October 12, 2026 -- The global market for data center racks drawing more than 100 kW is forecast to grow from USD 37.2 billion in 2025 to USD 52.5 billion by 2034, a 3.5% CAGR, according to a new Credence Research Inc. report.

AI training and inference, accelerated computing and high-performance computing (HPC) workloads are driving demand. They require substantially more rack-level power and cooling than conventional enterprise infrastructure. Direct-to-chip liquid cooling, rear-door heat exchangers, immersion-ready enclosures and higher-capacity power distribution are becoming core design considerations for new deployments.

ASRock Rack Shows NVIDIA Vera Rubin AI Servers at OCP Summit

Taipei – October 12, 2026 -- ASRock Rack Inc. is displaying a Vera Rubin NVL72 rack platform, which it says will be available for deployment in the near future, at booth D37 of the 2026 OCP Global Summit in San Jose, California. The event runs October 12 to 15.

ASRock Rack pairs NVIDIA Vera CPUs and HGX Rubin NVL8 with liquid cooling

The 2UXGM-VERA2 carries two NVIDIA Vera CPUs. ASRock Rack built it for agentic AI workloads, citing complex data pipelines and multi-step reasoning.

The 2U16X-GNR2/DLC Rubin is fully liquid-cooled and uses the NVIDIA HGX Rubin NVL8 platform. The company says it provides unified compute and memory bandwidth for massive-scale reasoning models.

The 6UXGM-GNR2 CX8/DLC is based on NVIDIA MGX architecture. It supports liquid-cooled NVIDIA RTX PRO 6000 Blackwell Server Edition GPUs for enterprise AI, visual computing and inference deployments.