San Jose – October 13, 2026 -- Compal Electronics (TWSE: 2324) will show an eight-GPU, liquid-cooled NVIDIA Blackwell Ultra server alongside Rubin-based and Vera CPU systems at OCP Global Summit 2026. The company is pitching shorter time-to-AI to cloud service providers, enterprises and AI infrastructure operators.
Compal's 4U OG430-2-L1 server packs eight Blackwell Ultra GPUs
The OG430-2-L1 is a 4U direct liquid-cooled server built on the NVIDIA HGX B300 platform with eight NVIDIA Blackwell Ultra GPUs. It targets AI training, reasoning, inference and HPC workloads. Compal bundles platform engineering, liquid cooling, system validation, rack integration and manufacturing readiness to cut the engineering effort between buying new accelerators and running them in production.
Rubin-ready OG231-2-L1 and a 44U rack extend the lineup
The OG231-2-L1 pairs Intel processors with NVIDIA HGX Rubin NVL8, aimed at more demanding reasoning and inference workloads. Compal will also show a 44U NVIDIA HGX Rubin NVL8 system, extending its work from individual servers to rack-scale integration.
Vera CPU tray and Spectrum-X switch target agentic AI bottlenecks
Compal says agentic AI is raising CPU-intensive demands for data processing, orchestration, tool use and code execution. Larger AI clusters also need more powerful networking. The company will exhibit a 1U NVIDIA Vera CPU compute tray and the NVIDIA Spectrum-X SN6600 Ethernet switch, which supports up to 128 ports of 800GbE connectivity.
Alan Chang, Vice President of Compal's Infrastructure Systems Business Group, said "new silicon only creates value when it can be turned into infrastructure customers can deploy and scale."