data_center_cooling

WILMINGTON, Del. – November 02, 2026 -- The Chemours Company (NYSE: CC) has launched Faizeon, a five-fluid portfolio for two-phase liquid cooling in AI, high-performance computing (HPC) and high-density data centers. In independent third-party testing, a two-phase direct-to-chip system using Faizeon 200 kept a GPU up to 19 degrees Celsius cooler than a single-phase, water-based fluid, at a lower coolant flow rate.

Chemours splits the Faizeon range into four direct-to-chip fluids and one immersion fluid

The portfolio covers both two-phase direct-to-chip and two-phase immersion cooling. The fluids absorb heat by changing from liquid to vapor, which removes heat from high-power processors and servers as chip power and rack densities rise.

The range breaks down as follows:

New York – October 30, 2026 -- Daikin U.S. Corporation expects its North American data center cooling business to exceed approximately $3.3 billion by FY2030 and plans to raise production capacity to 2.5 times 2024 levels, according to its annual U.S. Business and Innovation Report.

Daikin plans $163 million test lab and San Diego hub for data center cooling

The company is investing in a new Data Center Hub in San Diego to accelerate solution development and customer engagement. It is also planning a $163 million Advanced R&D Test Lab to develop next-generation cooling technologies. Daikin attributes the growth opportunity to rapid expansion of artificial intelligence, cloud computing and digital services, which is increasing demand for advanced cooling.

San Jose – October 16, 2026 -- Midea's Clivet brand has unveiled a magnetic-bearing centrifugal compressor that cuts compressor power by up to 40% at the same cooling capacity, targeting GW-scale AI data centers, at the 2026 OCP Global Summit.

Clivet presented the compressor and a full-chain liquid cooling solution at the "GW-Scale Open AIDC" forum. Dr. Yunxiao Ding, Director of the Research Institute at Midea Building Technologies, delivered the presentation, and Clivet received the "2026 GW-Scale Open AIDC Excellent Technical Presentation Award."

Rising cold-plate temperatures of 45°C create three engineering problems

As cold-plate supply temperatures rise toward 45°C, free cooling opportunities expand, while water constraints favor dry heat rejection. Prioritizing free cooling with mechanical-cooling backup raises three challenges:

London – October 16, 2026 -- The global data center precision air conditioning market will grow from USD 4.88 billion in 2025 to USD 10.00 billion by 2035, a 7.43% CAGR, according to a new DC Market Insights report. Rising AI rack density is shifting spending toward fan walls, in-row coolers, rear-door heat exchangers and retrofit services.

New-build capacity of 12.0 GW a year supports USD 2.75 billion in equipment spending

New data center capacity of about 12.0 GW a year supports roughly USD 2.75 billion of new-build precision air-conditioning spending, the report states. The analysis covers four product types: perimeter CRAC and CRAH units, in-row and rack-based coolers, fan walls and thermal walls, and rear-door heat exchangers.

Kaohsiung – September 29, 2026 -- Sunonwealth Electric Machine Industry Co., Ltd., known as SUNON, will present a full chip-to-rack liquid cooling portfolio at the OCP Global Summit 2026, running October 12-15 at the San Jose McEnery Convention Center in California.

SUNON targets rising AI chip power densities with a three-tier cooling architecture

Under the banner "Build to Chill," SUNON's booth A19 display spans chip-level, server-level, and rack-level liquid cooling technologies. The company positions the integrated stack to address a range of power densities, operating environments, and system requirements as AI accelerators push thermal loads beyond the limits of traditional air cooling.

NINGBO, China -- September 01, 2026 -- Ningbo Longwell Electric Technology Co., Ltd. (LONGWELL) said its LWBE3G plug-fan platform cut CRAH fan energy consumption by 38% in a data center cooling deployment completed with a top-3 global precision cooling OEM. The Chinese EC fan and motor manufacturer released its AI-Era Data Center Cooling Pack on Aug. 31, 2026. LONGWELL delivered 12 engineering samples in 35 days and moved from specification lock to mass production in 90 days, compared with a 14-month development period plus a six-month ramp quoted by an incumbent European supplier for the same program.