AI Infrastructure

San Jose – October 14, 2026 -- LITEON Technology (2301) is debuting a 2.6MW Enterprise Cooling Distribution Unit (CDU) and a full 800 VDC power stack for AI factories at the OCP Global Summit 2026, running October 12-15 in San Jose, California.

LITEON debuts 2.6MW CDU from investment partner DCX Liquid Cooling Systems

The Enterprise CDU comes from DCX Liquid Cooling Systems, a strategic investment partner of LITEON. It delivers up to 2.6MW of heat transfer capacity and an approach temperature of 3°C. An N+1 redundant pump design is built in for high-density AI and HPC deployments. The unit also carries a next-generation HMI and an integrated software layer for at-a-glance visibility into key system parameters.

LITEON is also showing an 800 VDC Power Shelf integrated with a Battery Backup Unit (BBU).

Ann Arbor – October 14, 2026 -- Internet-facing AI infrastructure grew 63% in nine months to nearly 268,000 systems, according to the fifth annual State of the Internet Report from Censys. The report also counts roughly 134,000 Internet-exposed hosts running industrial control systems (ICS). About 70% of those sit on consumer and mobile networks, which complicates efforts to identify their owners and close the exposure.

n8n and OpenClaw dominate exposed AI tooling

The Censys Advanced Research Collective (ARC) drew on historical and real-time data from the Censys Internet Map. The exposed AI category covers chatbots as well as the tools that connect AI to data, applications and user accounts.

COLUMBUS, Ohio – October 14, 2026 -- Vertiv Holdings Co. (NYSE: VRT) and the Deloitte Center for Integrated Research have introduced a collaboration built around a guide that sorts enterprise AI workloads into six archetypes and maps each to one of four physical infrastructure models.

The Vertiv Designing Infrastructure for Enterprise AI Guide was developed by Vertiv and STL Partners, a digital infrastructure research firm. It is aimed at business, IT and facilities leaders who must decide where AI workloads should run and whether available infrastructure can support them before they commit to an infrastructure plan.

Redwood City – October 14, 2026 -- The worldwide Data Center Physical Infrastructure (DCPI) market grew 27% year-over-year to $14 billion in manufacturer revenue in the second quarter of 2026, according to Dell'Oro Group. Growth has now run above 20% for consecutive quarters as demand for AI data center capacity outpaces supply. Dell'Oro attributes the modest slowdown from 1Q 2026 to a tougher comparison base, not weaker demand.

The research firm now ranks siting and permitting as the most serious near-term brake on the market. "The quieter and more consequential one is whether it will be permitted," said Alex Cordovil, Research Director at Dell'Oro, contrasting the issue with the louder debate over project cancellations. He said power availability, long-lead equipment and community opposition are stretching project timelines. He added that the timing of permits and grid interconnections is harder to forecast than the demand behind them.

Austin – October 14, 2026 -- Flex (NASDAQ: FLEX) has completed its acquisition of EPC Power, adding a power conversion provider with more than 15 GW deployed to its Cloud and Power Infrastructure segment weeks before shareholders weigh the planned spin-off of that unit.

EPC Power joins Flex's Cloud and Power Infrastructure segment

EPC Power supplies intelligent power conversion solutions for data center and grid applications. Flex said the acquisition expands its capabilities across power, cooling and compute as demand grows for higher-density AI infrastructure and next-generation 800V data center power architectures.

Flex did not disclose the purchase price or other financial terms.

Dallas – October 14, 2026 -- Solidion Technology (NASDAQ: STI) says its PEAK Series uninterruptible power supply (UPS) system can cut UPS footprint by up to 30%, based on company testing, as it targets AI data center operators short on floor space.

PEAK Series uses a proprietary 5500 silicon-carbon anode cell

The PEAK Series is a UPS battery system built for AI data centers around Solidion's proprietary 5500 silicon-carbon anode cell. The company says the design is meant to free floor space that operators could otherwise use for servers and additional computing equipment.

Rising power density in AI facilities is increasing pressure on the systems that keep sites running during grid disruptions, according to the company. UPS batteries occupy space that could hold computing hardware and require periodic replacement.

San Jose – October 13, 2026 -- Compal Electronics (TWSE: 2324) will show an eight-GPU, liquid-cooled NVIDIA Blackwell Ultra server alongside Rubin-based and Vera CPU systems at OCP Global Summit 2026. The company is pitching shorter time-to-AI to cloud service providers, enterprises and AI infrastructure operators.

Compal's 4U OG430-2-L1 server packs eight Blackwell Ultra GPUs

The OG430-2-L1 is a 4U direct liquid-cooled server built on the NVIDIA HGX B300 platform with eight NVIDIA Blackwell Ultra GPUs. It targets AI training, reasoning, inference and HPC workloads. Compal bundles platform engineering, liquid cooling, system validation, rack integration and manufacturing readiness to cut the engineering effort between buying new accelerators and running them in production.

San Jose – October 13, 2026 -- CyberTAN Technology has unveiled a liquid-cooled Ethernet switch platform architecture built around Marvell's 102.4 Tbps Teralynx T100 silicon, and says a live demonstration at OCP Global Summit 2026 reached a Power Usage Effectiveness (PUE) of 1.1.

Pallas Series targets 1,000-watt heat loads with direct-to-chip cooling

The Pallas Series 1.6T platform is designed to accommodate the 3nm Marvell T100 and its 25% energy-saving advantage. CyberTAN pairs the silicon with its proprietary Direct-to-Chip (D2C) liquid-cooling engineering. The company says the design can manage more than 1,000 watts of localized heat dissipation while keeping port density high.

CyberTAN frames the work as a response to thermal and power limits in AI clusters, where generative AI and hyperscale workloads are driving demand for more efficient silicon and rack-level cooling.

San Jose – October 13, 2026 -- UfiSpace is demonstrating a live 102.4Tbps liquid-cooled switch with 64 x 1.6T OSFP ports at OCP Global Summit 2026, aiming to prove thermal feasibility for 1.6T AI fabrics as data centers move toward extreme power densities.

Liquid-cooled Tomahawk 6 platform runs with a cooling distribution unit

The S9331-64HO3L is a 2OU ORv3 platform built on the Broadcom Tomahawk 6 ASIC. It operates with a Cooling Distribution Unit (CDU) to deliver real-time cooling. UfiSpace describes it as a validation-ready, early-access architecture and a proof-of-concept for the thermal and mechanical designs needed for 2027/2028 AI clusters.

San Jose – October 13, 2026 -- MSI is expanding its 21-inch ORv3 portfolio with DC-MHS-based 2-node platforms on AMD EPYC 9006 Series processors, supporting up to 600W TDP per node, at the 2026 OCP Global Summit (Booth #A49). The systems come in 2OU air-cooled and 1OU direct liquid-cooled versions and lead a booth lineup that also includes NVIDIA MGX rack and GPU server platforms and the XpertStation WS300 desktop AI supercomputer.

MSI offers two ORv3 nodes with 48V busbar power and PCIe 6.0

Both ORv3 platforms combine 48V busbar power, PCIe 6.0 connectivity and DC-SCM-based management. Memory speeds reach 8,000 MT/s with RDIMM and 12,800 MT/s with MRDIMM. Each node carries 2 PCIe 6.0 x16 expansion slots and front-access NVMe storage.