Oulu – October 23, 2026 -- Aspocomp has appointed Dominic Büch, a PCB industry professional with 14 years of experience, as Sales Manager for Central Europe, with a focus on defence and semiconductor customers.
Büch moves from product management to key account sales
Büch previously worked as Product Manager for HDI and wire bonding. He later became Key Account Manager for global electronics manufacturers. At Aspocomp he is responsible for technical sales and customer relationships across Central Europe.
Defence and semiconductor sectors drive demand for technical PCB support
Büch says customers in both sectors are actively seeking reliable, high-performance PCB partners. Early involvement is central to his approach: Aspocomp flags manufacturability issues and material risks during the layout phase to help customers avoid costly iterations.
His remit covers RF performance, impedance control, heat management and fine-pitch layouts. Aspocomp backs these applications with high-mix production capability and design-for-manufacturability (DFM) support, aimed at advanced and time-critical projects.
Oulu factory expansion stays on schedule
Aspocomp says the expansion of its Oulu factory in Finland is progressing as planned. It enables new process improvements and supports future growth. The company is also adding staff in Central Europe to speed up customer response times.
The Finnish factory and the international sales teams work together to create rapid feedback loops and shared learnings. Aspocomp says this produces more robust processes and fewer surprises.
Resilient supply chains shape customer sourcing decisions
Aspocomp says customers are shifting sourcing strategies to build more resilient and transparent supply chains. Central Europe is a region with high expectations for delivery performance, documentation and quality. Büch described the company's offer as "the responsiveness of a European partner and the strategic insight of an international team."