San Jose – October 12, 2026 -- Wiwynn unveiled a 6kW double-sided cold plate that it says cuts power delivery loss by up to 80%, alongside AI rack platforms for NVIDIA and AMD and a co-packaged optics (CPO) rack, at the 2026 OCP Global Summit in San Jose.
Wiwynn joins NVIDIA Vera Rubin NVL72 pilot build program
Wiwynn and Wistron are among the first NVIDIA Pilot Build Partners for the Vera Rubin NVL72 platform, covering engineering validation and design-in. The liquid-cooled, rack-scale system integrates 72 NVIDIA Rubin GPUs and 36 NVIDIA Vera CPUs with 6th-generation NVIDIA NVLink.
Wiwynn is also applying its rack integration and manufacturing capabilities to AMD's Helios rackscale solution, built on the Open Rack Wide (ORW) standard. Helios combines AMD Instinct MI450 Series GPUs, 6th Gen AMD EPYC CPUs, AMD Pensando networking and AMD ROCm software, with configurations tailored to cloud service provider (CSP) requirements.
6kW cold plate targets thermal and power-delivery limits
The ultra-thin double-sided cold plate uses a cavity PCBA design for high-power AI ASICs with Vertical Power Delivery (VPD). Wiwynn cites 6kW of cooling capacity, thermal performance gains of more than 15% and up to 80% lower power delivery loss.
A separate lightweight design reduces metal in cold plates and inner manifolds and uses lighter tubing, cutting cooling component weight by at least 30%. Wiwynn says this eases integration, transport and installation of high-density AI racks.
Diamond-to-silicon bonding and Corintis microchannels target chip-level heat
Wiwynn is exploring diamond-based composite materials as an alternative to copper. Its demonstration shows direct diamond-to-silicon bonding with integrated microchannel structures for on-package cooling, shortening the heat transfer path at the chip.
With Corintis, Wiwynn will show topology-optimized microchannel cold plates designed around chip power maps, aimed at high heat flux regions while balancing thermal and hydraulic performance.
CPO scale-up rack brings Ayar Labs, Corning, GUC and Senko together
Wiwynn's CPO scale-up rack covers rack-level fiber routing, patch panel integration and multi-vendor fiber management. Partners include Ayar Labs, Corning, GUC and Senko. A live demonstration will show optical engine telemetry.
CEO William Lin said Wiwynn is pairing custom design and high-volume rack integration with continued investment in cooling, power and optical interconnect for CSP customers.
The technologies will be covered in Executive Track and Expo Hall Talk sessions, engineering workshops and the Future Technology Symposium. Wiwynn is exhibiting at Booth C74.