Semiconductor Materials

Milwaukee – November 10, 2026 -- Entegris, Inc., a supplier of advanced materials and process solutions for the semiconductor industry with about 9,000 employees, has acquired Advanced Abrasives Corporation, a maker of precision abrasive products for high-tech manufacturing. TKO Miller, a middle market investment bank, announced the transaction and said it acted as exclusive investment banking advisor to Advanced Abrasives. The announcement did not include deal terms.

Advanced Abrasives brings diamond-based grinding and polishing products to Entegris

Advanced Abrasives develops and manufactures diamond-based abrasive products used in precision grinding, polishing and surface finishing. It serves the semiconductor, advanced manufacturing and other high-tech industries and offers customized solutions built around demanding performance and precision requirements.

SAN FRANCISCO – November 06, 2026 -- Diamond Foundry Inc. has produced the first single-crystal diamond measuring 200 millimeters in diameter, a size the company says brings the material to semiconductor wafer scale.

The company unveiled the D200mm crystal alongside a video keynote by CEO Martin Roscheisen at CarbonSemi 2026 in Ningbo, China. Diamond Foundry states the crystal is neither an assembly of smaller diamond pieces nor a polycrystalline wafer. The first crystal is shown as grown and unpolished.

Crystal size has been the main constraint on diamond in electronics

Diamond Foundry says diamond combines the highest thermal conductivity with mechanical strength, electrical insulation and optical properties. Its use in advanced technology has been limited by crystal size. Natural diamond is constrained by geology, and conventional lab-grown diamond has historically been limited to relatively small crystals, according to the company.