Pittsburgh – October 06, 2026 -- NovoLINC's MaxLINC thermal interface material has sustained 400 W/cm2 uniform heat flux and 3,300 W of total power on a production-representative silicon test die carrying roughly 150 μm of warpage, keeping junction temperatures below 90°C throughout the test.
MaxLINC maintains sub-90°C junction temperatures despite 150 μm die warpage
The demonstration used a single-phase direct liquid cooling cold plate from CoolIT, an Ecolab Company. As AI packages grow larger and power-denser, even minor flatness deviations create uneven contact between semiconductor and cooling hardware, raising thermal resistance and risking localized hot spots. NovoLINC's nanostructured composite architecture is designed to preserve thermal contact despite such non-flat surfaces.
Test reaches 3,300 W total device power on a single die
The 3,300 W figure highlights MaxLINC's potential to address escalating thermal loads from next-generation GPUs, CPUs, ASICs and other AI accelerators as compute moves toward multi-kilowatt processors.
NovoLINC and CoolIT position single-phase liquid cooling as a multi-year solution
"Pairing CoolIT's advanced cold plate technology with NovoLINC's MaxLINC shows that single-phase DLC can handle high-heat-flux processors well into the next decade, without the cost and complexity of switching cooling architectures," said Ben Sutton, Product Marketing Manager at CoolIT.
NovoLINC CTO Dr. Sheng Shen said the company is working with partners across single-phase, two-phase and immersion cooling categories, framing the results as part of a broader thermal roadmap for higher-power chips and AI server architectures. CEO Dr. Ning Li said the goal is to remove the thermal interface as a limiting factor for chip and system designers.
MaxLINC samples now open for customer evaluation and qualification
The platform is built for use across the full thermal pathway, including chip-to-cooling interfaces, chip-to-package heat spreaders, and interfaces between packaged devices and cold plates or other advanced cooling hardware.