NovoLINC

Pittsburgh – October 06, 2026 -- NovoLINC's MaxLINC thermal interface material has sustained 400 W/cm2 uniform heat flux and 3,300 W of total power on a production-representative silicon test die carrying roughly 150 μm of warpage, keeping junction temperatures below 90°C throughout the test.

MaxLINC maintains sub-90°C junction temperatures despite 150 μm die warpage

The demonstration used a single-phase direct liquid cooling cold plate from CoolIT, an Ecolab Company. As AI packages grow larger and power-denser, even minor flatness deviations create uneven contact between semiconductor and cooling hardware, raising thermal resistance and risking localized hot spots. NovoLINC's nanostructured composite architecture is designed to preserve thermal contact despite such non-flat surfaces.