Electronics Manufacturing

SAN FRANCISCO – November 06, 2026 -- Diamond Foundry Inc. has produced the first single-crystal diamond measuring 200 millimeters in diameter, a size the company says brings the material to semiconductor wafer scale.

The company unveiled the D200mm crystal alongside a video keynote by CEO Martin Roscheisen at CarbonSemi 2026 in Ningbo, China. Diamond Foundry states the crystal is neither an assembly of smaller diamond pieces nor a polycrystalline wafer. The first crystal is shown as grown and unpolished.

Crystal size has been the main constraint on diamond in electronics

Diamond Foundry says diamond combines the highest thermal conductivity with mechanical strength, electrical insulation and optical properties. Its use in advanced technology has been limited by crystal size. Natural diamond is constrained by geology, and conventional lab-grown diamond has historically been limited to relatively small crystals, according to the company.

Hsinchu – November 05, 2026 -- Macronix International Co., Ltd. (TSE: 2337) has become the first Taiwanese semiconductor company to receive an IEEE Milestone, awarded for its sNOVA industrial production optimization platform, which the company developed between its 1989 founding and 1997.

IEEE presents plaque to Macronix chairman at November 2 ceremony

Jill Gostin, 2026 IEEE president-elect, handed the recognition plaque to Dr. Miin Wu, Macronix chairman and CEO. Dr. Cheng-Wen Wu, minister of Taiwan's National Science and Technology Council (NSTC), attended the ceremony.

IEEE launched its Milestones program in 1983. An honored achievement must be at least 25 years old and have at least regional impact. More than 300 Milestones have been approved worldwide to date.

Beverly, Mass. – November 05, 2026 -- Axcelis Technologies (Nasdaq: ACLS) reported third-quarter 2026 revenue of $237.8 million and guided fourth-quarter revenue to approximately $275 million, about 16% above the quarter just reported.

Axcelis posts non-GAAP EPS of $1.26 on a 41.2% gross margin

GAAP gross margin was 41.0% and non-GAAP gross margin was 41.2%. GAAP operating margin reached 11.5%, against 16.6% on a non-GAAP basis. Diluted earnings per share came in at $1.21 on a GAAP basis and $1.26 non-GAAP.

Interim CFO David Ryzhik said results exceeded company expectations on stronger shipments and record revenue from Customer Solutions and Installed base (CS&I). He said foreign exchange headwinds weighed on gross margin.

Lafayette, Colorado – November 04, 2026 -- Intel Corporation has joined the Semiconductor Pathways Fund, a six-member industry coalition targeting $20 million to keep 6,700 students on track to graduate by 2028, Last Mile Education Fund announced.

Intel becomes sixth corporate backer of the workforce fund

The fund launched in November 2025 with Applied Materials as founding partner. Lam Research, KLA Foundation and Cadence Design Systems made inaugural investments, and the AMD Foundation has since joined. Intel is the latest addition.

Awards averaging under $3,000 target last-mile financial gaps

The fund issues rapid, flexible awards averaging less than $3,000. They cover obstacles such as an unpaid tuition balance, a car repair or a housing emergency that can stop a near-graduate from finishing.

Fremont – November 04, 2026 -- Socket Mobile (NASDAQ: SCKT) cut its third-quarter operating loss to $643,000 from $1,058,000 a year earlier, as revenue rose 9% to $3.4 million and operating expenses fell to $2.3 million.

Revenue climbs 12% sequentially to $3.4 million

Quarterly revenue compared with $3.1 million in the prior-year quarter and $3.0 million in the second quarter of 2026. Gross margin reached 48.6%, up from 47.7% a year earlier and 46.4% in the preceding quarter.

Operating expenses fall to $2.3 million from $2.6 million in Q2

Spending was $2.5 million in the prior-year period. CEO Dave Holmes put the reductions at 12% quarter on quarter and 10% year over year. The operating loss was $1,195,000 in the second quarter, so the Q3 figure is roughly 46% lower sequentially.

TAIPEI – November 05, 2026 -- SINBON Electronics (TWSE:3023) has linked senior management pay to sustainability results for the first time, giving ESG metrics a 20% weighting in annual performance assessments, according to its 2025 Sustainability Report.

SINBON applies ESG pay policy to CEO, President, Vice Presidents and first-tier managers

The Policy on Linking Executive Compensation to ESG-Related Performance Evaluation was formally established in 2025. It covers the CEO, President, Vice Presidents, and first-tier managers of business units and support functions. The 20% weighting covers seven areas: talent sustainability, occupational safety, integrity and legal compliance, sustainable procurement, sustainability awareness, climate change, and sustainable products and services.

DALLAS – November 05, 2026 -- Texas Instruments (Nasdaq: TXN) has introduced a system-on-module that lets engineers switch between EtherCAT, EtherNet/IP and Profinet through a firmware update, alongside a dual-channel IO-Link master aimed at sensor-to-network integration in factory automation, robotics and Industrial IoT systems.

TICS100MOD runs three Industrial Ethernet protocols on one board

The TICS100MOD is built on TI's AM2612 microcontroller and DP83826AI Ethernet physical layer. TI describes it as the industry's smallest fully featured, certified communications SoM. Engineers select the protocol at boot time via firmware, so a single hardware design can serve different customer or regional requirements without a redesign.

The module integrates two Arm Cortex-R5F cores and external memory. TI says this is enough compute for fully featured protocol stacks and advanced factory automation applications.

SHANGHAI – November 05, 2026 -- NSING Technologies has shipped more than 250 million Bluetooth chips incorporating Ceva-Waves Bluetooth Low Energy (LE) IP, licensor Ceva, Inc. (NASDAQ: CEVA) announced.

NSING builds its Bluetooth portfolio on Ceva's licensed connectivity IP

The Chinese semiconductor company combines Ceva's Bluetooth LE technology with its own low-power RF designs and MCU architectures. According to Ceva, this approach shortened product development and kept performance and standards compliance consistent across successive product generations.

KYOTO – November 05, 2026 -- Nuvoton Technology Corporation Japan (NTCJ) and Qt Group (Nasdaq Helsinki: QTCOM) have added Nuvoton's Gerda HMI controller platform as target hardware for Qt for MCUs, enabling premium graphical interfaces without external memory.

Built-in RAM removes external memory from the bill of materials

Gerda's large built-in RAM and its display, connectivity and control interfaces allow standalone HMI systems with no external memory. Qt for MCUs' graphics optimization and Gerda's texture compression shrink the GUI memory footprint. The companies say the result is a lower component count and lower total system cost, which matters most in high-volume products.

Target applications range from automotive and motorcycle instrument clusters and head-up displays to home appliance display panels. The companies demonstrated a motorcycle instrument cluster and a washing machine interface.

TAIPEI – November 05, 2026 -- Taiwan-based GaNrich Semiconductor has built a gallium nitride (GaN) power device portfolio covering 40V to 1200V on both GaN-on-Si and GaN-on-Sapphire platforms. The company says it is currently the only GaN designer able to supply mass-production GaN product for customer validation in Taiwan.

GaNrich covers low-mid and high voltage ranges for AI data centers and EVs

The 40V-250V line targets applications where traditional silicon devices have reached their performance limits. GaNrich has completed development of 5x6, 5x3 and 3x3 packages that are compatible with existing standard silicon devices. It also integrates gate drivers into the same package to simplify circuit design.