Electronics Manufacturing

Spirox Unveils SP7000G to Speed Glass Substrate Crack Inspection

Image
Spirox Unveils SP7000G to Speed Glass Substrate Crack Inspection

Hsinchu – September 10, 2026 -- Spirox Corporation (TWSE: 3055) has launched the SP7000G High-Speed TGV Crack Inspection System, a tool capable of scanning a full 510 mm x 515 mm glass substrate panel in under 20 minutes to detect internal microcracks in high-volume Glass Core and Through Glass Via (TGV) manufacturing.

New system targets microcrack detection after critical build-up processes

The SP7000G is designed to identify internal microcracks that emerge after metallization and Ajinomoto Build-up Film (ABF) processes, key stages in advanced packaging production. Spirox positions the system to improve inspection efficiency, monitor process quality and defect distribution, and optimize manufacturing yield as TGV technology scales toward high-volume output.

Shenzhen to Host 1,200-Exhibitor Film & Tape Expo in October 2026

Shenzhen – September 10, 2026 -- FILM & TAPE EXPO 2026 will gather more than 1,200 exhibitors and brands and 60,000 professional buyers in Shenzhen from October 27-29, 2026, positioning the event as a major sourcing hub for global functional film, adhesive tape, coating and converting industries. Organized by Kuozhan Exhibition Services (Shanghai) Limited as part of ASIA MATERIAL WEEK, the fair will occupy 80,000 square meters at the Shenzhen World Exhibition & Convention Center in Bao'an.

The show is expected to feature more than 200 new product launches and 30-plus technical forums, covering the full supply chain from raw materials to manufacturing equipment.

Shenzhen Expo to Debut TGV Glass Substrate Line, AI+AR Glasses Zone

Shenzhen – September 10, 2026 -- C-TOUCH & DISPLAY SHENZHEN 2026 will occupy 180,000 square meters across four halls at the Shenzhen World Exhibition & Convention Center from October 27-29, drawing over 3,600 exhibitors and 170,000 professional visitors, including more than 5,000 overseas buyers.

The 29th edition of the show introduces three dedicated technology zones targeting emerging display-photonics convergence, according to organizer RX Kuozhan, a joint venture between Reed Exhibitions and Kuozhan Exhibition Services Shanghai established in 2015.

Nocpix Teases Next-Gen Flagship Thermal Scope for Hunters

Warsaw – September 10, 2026 -- Nocpix, a developer of electro-optical imaging technology for outdoor use, has unveiled a preview of the next generation of its flagship thermal riflescope, targeting professional hunters with upgraded sensor, optics and decision-support technology.

Nocpix confirms next-gen scope will retain Ocular Zoom and add Reality+ imaging

The upcoming model builds on Nocpix's existing flagship line, which combines proprietary thermal sensors, high-performance optics and the company's Ocular Zoom function inside a traditional tube-style scope body. Select current models also integrate a laser rangefinder and ballistic calculator. The next generation will incorporate Nocpix's new Reality+ imaging technology alongside Ocular Zoom, with rangefinder and ballistic-calculation capabilities continuing on certain models.

Morpho's Desktop UV Printer Debuts at IFA 2026, Tops $10M on Kickstarter

Image
Morpho's Desktop UV Printer Debuts at IFA 2026, Tops $10M on Kickstarter

Berlin – September 10, 2026 -- Morpho, a UV printing technology company, unveiled its first desktop UV printer at IFA 2026, booth 17-196, following a Kickstarter campaign that has surpassed $10 million in pledges from more than 2,800 backers worldwide.

Live demonstrations draw creators and manufacturers to the Berlin show floor

Attendees at the Morpho booth watched real-time printing demonstrations and, in some cases, printed on blank materials provided on site. The device prints on wood, glass, leather, metal and other substrates, producing colored, textured output aimed at customization use cases.

Puyol Joins Midea at IFA 2026 to Mark FC Barcelona Sponsorship

Image
Puyol Joins Midea at IFA 2026 to Mark FC Barcelona Sponsorship

Berlin – September 09, 2026 -- FC Barcelona legend Carles Puyol appeared at Midea's stand at IFA 2026 in Berlin, marking a consumer-facing milestone in the five-year sponsorship deal between the Chinese appliance maker and the Spanish football club.

Midea uses former club captain to promote five-year FC Barcelona tie-up at IFA

The former Barcelona captain joined Midea International president Lewis Fu to present a personalized FC Barcelona jersey and tour the company's SMART MASTER smart-home zone alongside a dedicated FC Barcelona exhibition space.

GEEKOM Launches A5 2027 Edition Mini PC With 3-Year Warranty

Image
GEEKOM Launches A5 2027 Edition Mini PC With 3-Year Warranty

Taipei – September 09, 2026 -- GEEKOM has launched the A5 2027 Edition Mini PC, engineered for continuous business use with a three-year warranty and a target service life of more than five years.

AMD Ryzen 7730U chip targets multitasking-heavy office workloads

The device runs on an 8-core, 16-thread AMD Ryzen 7 7730U processor, supporting up to 64GB of memory, 7TB of storage and four-display output. GEEKOM positions the machine for tasks including 30-plus open browser tabs alongside video calls, large spreadsheets, Photoshop, 2D design and light 4K editing.

339 validation checks underpin durability claims

GEEKOM built the A5 2027 Edition with new SSDs, a reinforced all-metal internal frame and multi-layer motherboard protection. The unit undergoes 339 validation checks covering durability, aging and thermal stress before shipping, according to the company.

Thermoplastic Polyimide Market to Hit $0.86B by 2032 as APAC Leads

Image
Thermoplastic Polyimide Market to Hit $0.86B by 2032 as APAC Leads

Delray Beach – September 09, 2026 -- The global thermoplastic polyimide market is projected to expand from $0.56 billion in 2026 to $0.86 billion by 2032, growing at a compound annual rate of 7.4%, according to MarketsandMarkets.

Data center cooling and aerospace demand drive material adoption

Rising cloud computing, AI workloads, and big data processing are increasing heat generation in data centers, pushing operators toward high-performance thermal materials. Aerospace and defense manufacturers are also adopting thermoplastic polyimide for components requiring lightweight, high-temperature stability, alongside growing automotive and industrial machinery use cases demanding chemical and wear resistance.

Dahua Unveils WITHS, AirShield, WizTalk Security Lines at IFA 2026

Image
Dahua Unveils WITHS, AirShield, WizTalk Security Lines at IFA 2026

Berlin – September 09, 2026 -- Dahua Technology introduced three new product lines -- WITHS, AirShield and WizTalk -- at IFA Berlin 2026, expanding its video-focused AIoT portfolio into wireless surveillance, intrusion alarms and video intercom systems for residential, commercial and professional markets.

WITHS wireless line cuts cabling needs for security installs

The WITHS portfolio, built around a "Simple, Smart, Secure" concept, supports Wi-Fi, 4G and DMSS-app control to reduce wiring requirements for smaller installations managed via mobile devices, while NVR-based management handles larger deployments. Features include human, pet and vehicle detection, automatic tracking, gesture and facial recognition, AOV/AOR recording, WizColor imaging and two-way calling, with indoor, outdoor and off-grid options including solar and high-capacity battery power.

TrustKernel Ships PlugClaw, a Thumb-Sized Private AI Computer, Free Inference

Image
TrustKernel Ships PlugClaw, a Thumb-Sized Private AI Computer, Free Inference

London – September 09, 2026 -- TrustKernel has moved its PlugClaw device from pre-order to general availability worldwide, pricing the thumb-sized private AI computer at 128 EUR ($149) and adding free confidential model inference on newly deployed servers.

PlugClaw packs a full computer into a 50 x 19 x 8mm USB-C stick weighing 15 grams

The device runs a MediaTek Helio G80 processor with up to 6GB of RAM and 128GB of encrypted storage. It ships with PlugOS, a privacy-hardened Android build, alongside Ubuntu as an agent runtime environment, turning any connected smartphone, tablet or computer into an AI workstation.