Furukawa Electric

NEDO Backs NTT-Led Push for Mass-Produced Optical Chiplets

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NEDO Backs NTT-Led Push for Mass-Produced Optical Chiplets

Tokyo – October 21, 2026 -- A four-company consortium led by NTT Innovative Devices has been selected for a NEDO-backed project to build mass-production technologies for optical chiplets, with a target of more than a tenfold gain in manufacturing productivity over current R&D-stage processes.

Four manufacturers join the NEDO-selected consortium

The members are NTT Innovative Devices, Japan Semiconductor Corporation, Furukawa Electric and Shinko Electric Industries. NTT, Inc. participates as an advisor. The project falls under the New Energy and Industrial Technology Development Organization's program for enhanced post-5G information and communication infrastructure, specifically its development of manufacturing technologies for advanced semiconductors. Japan Semiconductor is a wholly owned subsidiary of Toshiba Electronic Devices & Storage Corporation.

Furukawa's Snap-Beam Connector Wins ECOC 2026 Fibre Innovation Award

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Furukawa's Snap-Beam Connector Wins ECOC 2026 Fibre Innovation Award

Malaga, Spain – September 23, 2026 -- Furukawa Electric Co., Ltd. and Lightera announced that the Snap-BeamTM Connector has won the Fibre Infrastructure Innovation Award at the ECOC Exhibition Industry Awards 2026, recognizing advances in optical connectivity for co-packaged optics (CPO) systems used in AI and data-center networks.

Snap-Beam Connector enables compact, detachable optical links for photonic integrated circuits

The Snap-Beam Connector provides detachable optical connectivity between photonic integrated circuits (PICs) and optical fibers within CPO systems. It combines expanded-beam optical coupling, magnet-based automatic connection, and reflow compatibility to deliver high-density optical interconnections with low insertion loss.