Ceva, Inc.

Rockville – – October 15, 2026 -- Ceva, Inc. (NASDAQ: CEVA), a licensor of silicon and software IP for the Smart Edge, will report third-quarter 2026 results on October 15, 2026, before the Nasdaq market opens.

Management call on results and outlook starts at 8:30 a.m. Eastern Time

Ceva management will hold a conference call at 8:30 a.m. ET on the same day. The call will cover third-quarter performance and the company's business outlook.

Participants in the U.S. and internationally can join by dial-in. The call will also be streamed live by webcast, and listeners must register on the webcast site at least 15 minutes before the start.

Replay stays available until 9:00 a.m. ET on October 15, 2026

A replay opens one hour after the call ends and runs until 9:00 a.m. ET on October 15, 2026. Investors can access it by phone or through the investor section of Ceva's website.

Rockville, Md. – September 18, 2026 -- Ceva, Inc. (NASDAQ: CEVA) has appointed Ziv Hammer as Executive Vice President, Connectivity & Sensing, a newly created role that consolidates the company's connectivity and sensing businesses along with its CTO Office under a single leader.

Hammer brings two decades of semiconductor leadership from Intel, Infineon and GlobalFoundries

Hammer joins Ceva after senior roles at Intel, Infineon Technologies and GlobalFoundries, where he led global engineering organizations of more than 1,000 employees spanning compute, connectivity, IoT and semiconductor technologies. Most recently, he served as Senior Vice President, Design Platforms and Services at GlobalFoundries, working across technology, IP, design enablement and ecosystem partners to move complex customized silicon designs from concept to production.

Rockville, Md. and Seoul, South Korea – September 13, 2026 -- Ceva, Inc. (NASDAQ: CEVA) and LG Electronics have secured a major U.S. semiconductor company as a customer for a jointly developed Ultra-Wideband (UWB) solution, marking commercial validation for the two-company collaboration announced today.

Ceva's baseband IP pairs with LG's RF technology on TSMC's 22nm process

The partnership combines Ceva-Waves UWB baseband and software with UWB radio frequency technology developed by LG's SoC Center, built on TSMC's 22nm process node. The integrated platform targets semiconductor and OEM developers building automotive, industrial and consumer products, aiming to cut engineering effort and integration risk for companies building UWB-enabled SoCs.