Axcelis Technologies

Axcelis Names Jeroen Delsman CFO Ahead of Veeco Merger

Image
Axcelis Names Jeroen Delsman CFO Ahead of Veeco Merger

Beverly, Mass. – October 27, 2026 -- Axcelis Technologies (Nasdaq: ACLS) has appointed Jeroen Delsman, a finance executive with more than 26 years of experience, as Executive Vice President and Chief Financial Officer effective November 12, 2026, as the ion implantation supplier prepares for its pending merger with Veeco.

Interim CFO Ryzhik takes over merger integration and investor relations

David Ryzhik, who has served as Interim CFO during the transition, becomes Senior Vice President, Corporate Development and Investor Relations. He will report directly to President and CEO Russell Low.

Ryzhik will lead integration planning and execution for the Veeco merger, along with corporate development, investor relations and other strategic initiatives. Low cited Ryzhik's knowledge of Axcelis' business and his experience supporting the Veeco transaction as the basis for the assignment.

Axcelis to Showcase SiC Implantation Tech at ICSCRM 2026 in Japan

Image
Axcelis to Showcase SiC Implantation Tech at ICSCRM 2026 in Japan

Beverly, Mass. – September 21, 2026 -- Axcelis Technologies (NASDAQ: ACLS) will exhibit at the 23rd International Conference on Silicon Carbide and Related Materials (ICSCRM 2026), targeting a silicon carbide device market Yole Group projects to reach $11 billion by 2031, expanding at a 20% compound annual growth rate from 2025 to 2031.

Axcelis Commits $35M to New Ion Implanter Plant in Korea

Image
Axcelis Commits $35M to New Ion Implanter Plant in Korea

Beverly, Mass. – September 11, 2026 -- Axcelis Technologies (Nasdaq: ACLS) will invest $35 million to build a new ion implantation equipment manufacturing facility in Pyeongtaek, Gyeonggi Province, Korea, with production slated to begin in the second half of 2028.

Axcelis expands Korean manufacturing footprint with 200,000-square-foot plant

The Pyeongtaek site will span approximately 200,000 square feet of gross floor area, integrating warehousing, Class 1,000 and Class 10,000 cleanrooms, and a dedicated training center. The company said the design draws on nearly 50 years of semiconductor capital equipment manufacturing experience to create a lean production environment aimed at faster, more flexible customer response.