Memory And Storage

Shenzhen – October 18, 2026 -- More than half of cloud data center capital expenditure is expected to go to memory and storage, excluding HBM, by 2027, according to a projection by Morgan Stanley's Daniel Yen presented at the 5th GMIF Innovation Summit. The forum, themed "The Future Built on AI Memory and Storage," was co-hosted by the Shenzhen Memory Industry Association (SMIA) and Peking University's School of Integrated Circuits at the Renaissance Shenzhen Bay Hotel.

Yen said global data center capex will stay strong in the coming years. He named six paths to overcome the "memory wall": process migration, design changes, advanced packaging, memory peripherals, PIM/CIM and new materials.

Shenzhen – October 12, 2026 -- The 5th Global Memory Innovation Forum (GMIF2026) has named 18 companies across memory, compute, packaging and testing equipment, test systems and end applications in its first GMIF2026 Annual Awards, led by Samsung Semiconductor, Sandisk, CXMT and Lenovo.

The summit was held at the Renaissance Shenzhen Bay Hotel and co-hosted by the Shenzhen Memory Industry Association and the School of Integrated Circuits at Peking University. Its theme was "The Future Built on AI Memory and Storage," with the token economy as a key lens. Winners were judged on technology innovation, industry contribution, market service and application results.