Electronics Manufacturing

Munich – – September 15, 2026 -- Silicon Line, a brand of EverProX Technologies Munich GmbH, has launched the MSDL 20G chipset, extending MIPI D-PHY connectivity from short-range cabling to distances of tens of meters while consuming less than 100 mW per 10 Gbps link.

Chipset aggregates dual 10 Gbps camera streams over fiber or copper

The MSDL 20G family comprises the SL8582x serializer and SL8581x deserializer, supporting up to two simultaneous serialized links of 10 Gbps each for multi-camera vision systems. The chipset targets bandwidth, EMI, and range limitations inherent in traditional MIPI D-PHY wiring, replacing bulky shielded cable bundles with optical fiber or differential copper connections.

Berlin – September 15, 2026 -- Rokid unveiled AIUI Studio at IFA Berlin 2026, a browser-based development platform that lets users build AI agent applications for its smart glasses without writing code.

Rokid opens spatial AI app creation to non-programmers via browser tool

AIUI Studio integrates the AIUI Skills Library framework and AIUI Code assistance, allowing developers to design, test and publish applications for Rokid AI Glasses entirely through natural-language prompts. Built-in hardware simulation removes the need for a physical device during testing, while the platform optimizes output for reduced latency, memory usage and power consumption on Rokid hardware.

Johannesburg – September 15, 2026 -- Tongxin Microelectronics (TMC TONGXIN MICRO) unveiled its THD89 payment chip series and E450R open-architecture security chip at Seamless Africa 2026, held September 8-9 in Johannesburg, positioning the Chinese semiconductor firm deeper into Africa's digital finance and identity infrastructure market.

THD89 becomes first China-developed chip to secure CC EAL6+ certification

The THD89 payment product line is used in smart payment cards compatible with UnionPay, Visa, Mastercard and JCB networks, protecting transactions for hundreds of millions of cardholders globally.

London – September 15, 2026 -- Tulip Licensing Ltd has launched Tulip Imaging, a patent licensing program granting implementers access to more than 125,000 patents covering digital imaging and information processing technologies contributed by Canon Inc., Sony Group Corporation, Huawei Technologies Co., Ltd., and Guangdong OPPO Mobile Telecommunications Corp., Ltd.

Four technology giants pool 125,000-plus patents into a single licensing program

The combined portfolio spans decades of research from four of the largest imaging technology developers globally, covering optics, cameras, image processing, computational photography, and artificial intelligence-driven imaging systems. Tulip describes the offering as the most significant consolidation of digital imaging and information processing patents to date, allowing implementers to tailor licenses to specific products and business needs rather than negotiating separately with each patent holder.

Venice – September 15, 2026 -- DJI convened a professional forum titled "Filmmakers and Visionaries" at the Venice Production Bridge during the 83rd Venice International Film Festival, positioning its pocket-sized Osmo Pocket 4P camera as a tool capable of matching large-scale production standards.

Venice – September 13, 2026 -- DJI staged a professional forum titled the "Filmmakers & Visionaries Session" at the Venice Production Bridge during the 83rd Venice International Film Festival, using the event to argue that its pocket-sized Osmo Pocket 4P camera can meet the technical standards of professional cinema.

DJI links Cannes and Venice campaigns around one camera

The Venice session extended a creative campaign DJI began in Cannes in May, when it handed the Osmo Pocket 4P to two filmmakers working independently on different continents. Actress and director Isabelle Huppert used the device to shoot "FAMILIARITÉ," a meditation on literature and memory, while Japanese cinematographer Mikiya Takimoto used it to shoot "Looking for Her," a road-movie narrative set in a historic silver-mining town. Both projects were filmed entirely on the Osmo Pocket 4P.

Austin, Texas – – September 13, 2026 -- La Luce Cristallina has launched a 0.5-micrometer silicon-based quantum paraelectric strontium titanate on insulator (QP-STOI) wafer platform, giving researchers and national laboratories a new tool for building next-generation cryogenic and quantum devices.

Rockville, Md. and Seoul, South Korea – September 13, 2026 -- Ceva, Inc. (NASDAQ: CEVA) and LG Electronics have secured a major U.S. semiconductor company as a customer for a jointly developed Ultra-Wideband (UWB) solution, marking commercial validation for the two-company collaboration announced today.

Ceva's baseband IP pairs with LG's RF technology on TSMC's 22nm process

The partnership combines Ceva-Waves UWB baseband and software with UWB radio frequency technology developed by LG's SoC Center, built on TSMC's 22nm process node. The integrated platform targets semiconductor and OEM developers building automotive, industrial and consumer products, aiming to cut engineering effort and integration risk for companies building UWB-enabled SoCs.

Seoul – September 13, 2026 -- SK keyfoundry has signed a long-term wafer supply agreement with Elmos Semiconductor SE that guarantees production capacity through 2037, extending an 18-year partnership between the Korean 8-inch foundry and the German automotive chipmaker.

The deal, signed during a ceremony in Frankfurt am Main, shifts the two companies' collaboration from 350nm to 130nm process technology, marking the first major node transition in nearly two decades of cooperation.

New 130nm platform enables deep-trench isolation for high-voltage automotive chips

SK keyfoundry's 130nm technology incorporates deep-trench isolation (DTI), which provides electrical separation and supports highly integrated, high-voltage circuit designs with low substrate current. The foundry positions this capability as the technical basis for a broader range of automotive semiconductor products developed with Elmos going forward.

Hsinchu – September 11, 2026 -- Spirox Corporation (TWSE: 3055) unveiled its SP7000G high-speed TGV crack inspection system, a tool designed to support mass production testing of glass substrates for next-generation AI and HPC packaging.

Spirox scans a full 510mm by 515mm glass substrate in under 20 minutes

The SP7000G detects internal micro-cracks after metallization and ABF build-up processes, according to the company. Spirox positions the system to improve inspection efficiency, monitor process quality and defect distribution, and optimize yield as Through Glass Via (TGV) technology moves toward volume manufacturing.